Wafer dicing is probably the processes popular in the semiconductor industry. It is just a method of separating a die from the wafer of semiconductor and this is accomplished using several methods like scribing and breaking, by mechanical sawing, or by laser cutting. Using wafer dicing machine, wafers are cut into individual semiconductor chips, with the help of dicing blades.
‘Wafer dicing methods’
Scribing and breaking – usually is done in a substrate manufactured from a brittle material where good-quality cutting surface of the substrate may be accomplished without any defects such as for example chippings on the substrate. This technique of semiconductor wafer separation is achieved by creating a stress in the wafer and then fracturing the wafer along the stress line. yoursite.com should be created in the wafer surface along the street where the break is desired.
Mechanical sawing – the procedure is done using a mechanical machine called dicing saw; this method can be used for a micro electro-mechanical system semiconductor devices. While you may still find manufacturers that utilize this method, it really is slowly getting unpopular due to several disadvantages – the process is slow, contaminant-laden, and dependent on regular shapes.
Laser cutting – a fresh and more effective technology to cut semiconductor materials; the process works by directing the output of a high-power laser at the material to be cut. This technique burns or vaporizes away the unwanted parts, leaving an advantage with a high-quality surface finish.
As mentioned above, dicing blades are employed and are a significant element for the dicing process. There are many types of dicing blades and some of them will be the following:
Hubbed Nickel Bonded Blades – this is used to cut Silicon and III-V materials. This blade is ultra-thin and made out of a special electrodepositing strategy to contain the cutting diamonds in a nickel alloy matrix.
Hubbed Resin Bonded Blades – with this type of blade, there is no need to buy expensive flanges because the resinoid blade is permanently mounted to its hub. Instead of flanges, after the blade is dressed, it usually is detached and reattached again without going right through the dressing process.
Hubless Resin Bonden Blades – this type of dicing blade performs very well on materials like ceramic, quartz, sapphire and glass. This may give minimum chipping and superior finish.
Metal Sintered Dicing Blades – this is usually a type of blade that is created by capturing diamonds in a metal binder using sintering process – this is usually a very rigid blade and has an extremely low wear rates. These properties offer the capability to create very straight cuts even when subjected to large exposures.